Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Title
Showing results 29901 to 29920 of 46995
| Wall-attached structures in a drag-reduced turbulent channel flow Yoon, Min; Sung, Hyung Jin, JOURNAL OF FLUID MECHANICS, v.943, 2022-06 |
| WALL-ATTACHED STRUCTURES IN A TURBULENT CHANNEL FLOW WITH NAVIER SLIP Yoon, Min; Sung, Hyung Jin, 12th International Symposium on Turbulence and Shear Flow Phenomena, TSFP 2022, International Symposium on Turbulence and Shear Flow Phenomena, TSFP, 2022-07 |
| Wall-Attached Structures in Turbulent Boundary Layers Sung, Hyung Jin, Asian Workshop on Theoretical and Applied Mechanics, Beijing International Center for Theoretical and Applied Mechanics, 2019-08-24 |
| Wall-attached structures of streamwise velocity fluctuations in an adverse-pressure-gradient turbulent boundary layer Yoon, Min; Hwang, Jinyul; Yang, Jongmin; Sung, Hyung Jin, JOURNAL OF FLUID MECHANICS, v.885, 2020-02 |
| Wall-attached Structures of Streamwise Velocity Fluctuations in Turbulent Boundary Layer Hwang, Jinyul; Sung, Hyung Jin, 70th Annual Meeting of the APS Division of Fluid Dynamics, the APS Division of Fluid Dynamics, 2017-11-19 |
| Wall-Attached Structures of Streamwise Velocity Fluctuations in Turbulent Pipe Flow Hwang, Jinyul; Sung, Hyung Jin, 71th Annual Meeting of the APS Division of Fluid Dynamics, American Physical Society (APS), 2018-11-18 |
| Wall-attached structures of velocity fluctuations in a turbulent boundary layer Hwang, Jinyul; Sung, Hyung Jin, JOURNAL OF FLUID MECHANICS, v.856, pp.958 - 983, 2018-09 |
| Wall-Attached Structures of Velocity Fluctuations in a Turbulent Boundary Layer Subjected to Adverse Pressure Gradient Yoon, Min; Hwang, Jinyul; Sung, Hyung Jin, 71th Annual Meeting of the APS Division of Fluid Dynamics, American Physical Society (APS), 2018-11-18 |
| Wall-Attached Structures of Velocity Fluctuations in a Turbulent Boundary Layer Subjected to Adverse Pressure Gradient Yoon, Min; Hwang, Jinyul; Yang, Jong-min; Sung, Hyung Jin, 11th International Symposium on Turbulence and Shear Flow Phenomena, Turbulence and Shear Flow Phenomena, 2019-08-01 |
| Wall-Attached Structures of Velocity Fluctuations in Wall-Bounded Turbulent Flow Sung, Hyung Jin, Interdisciplinary Turbulence Initiative (iTi 2018), Interdisciplinary Turbulence Initiative, 2018-09-05 |
| Wall-attached structures over a traveling wavy boundary: Scalar transport Wang, Li-Hao; Ma, Guo-Zhen; Xu, Chun-Xiao; Sung, Hyung Jin; Huang, Wei-Xi, PHYSICS OF FLUIDS, v.33, no.10, 2021-10 |
| Wall-attached structures over a traveling wavy boundary: Turbulent velocity fluctuations Wang, Li-Hao; Xu, Chun-Xiao; Sung, Hyung Jin; Huang, Wei-Xi, PHYSICAL REVIEW FLUIDS, v.6, no.3, 2021-03 |
| Wall-bounded periodic snap-through and contact of a buckled sheet Mahravan, Ehsan; Lahooti, Mohsen; Kim, Daegyoum, JOURNAL OF FLUID MECHANICS, v.976, no.A1, 2023-12 |
| Wall-pressure fluctuations measurement using microphone array - Correlation analysis of coherent structure in backward-facing step flow Liu, Y.-Z.; Ke, F.; Sung, Hyung Jin, SHANGHAI JIAOTONG DAXUE XUEBAO/JOURNAL OF SHANGHAI JIAOTONG UNIVERSITY, v.39, no.8, pp.1371 - 1374, 2005-08 |
| Wall-thinning Visualization of Aluminum Specimen Using Stroboscopic Acoustic Shearography Park, JW; Lee, Jung Ryul, The 2016 Asia-Pacific International Symposium on Aerospace Technology, The Japan Society of Aeronautical and Space Sciences, 2016-10 |
| Wankel 엔진의 에이펙스 시일 파손과 엔진 이상 폭발과의 관계 김승수, 한국자동차공학회지, v.7, no.1, 1985 |
| Wapage Analysis of Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging, The Japan Institute of Electronics Packaging, 2019-04-19 |
| Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers 김준모; 이태익; 조우성; 조민수; 김택수, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24 |
| Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |
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