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Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation Yeap, K.B.; Hangen, U; Ritz, Y; Kim, Taek-Soo; Dauskardt, R.H.; Zschech, E, Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop, pp.159 - 165, Proceedings of Stress-Induced Phenomena in Metallization, 2010-01-01 |
Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
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