Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 401 to 420 of 22767
| Event-Specific Audio-Visual Fusion Layers: A Simple and New Perspective on Video Understanding Senocak, Arda; Kim, Junsik; Oh, Tae-Hyun; Li, Dingzeyu; Kweon, In-So, 23rd IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2023, pp.2236 - 2246, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| Robust and Efficient Alignment of Calcium Imaging Data through Simultaneous Low Rank and Sparse Decomposition Cho, Junmo; Han, Seungjae; Cho, Eun-Seo; Shin, Kijung; Yoon, Young-Gyu, 23rd IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2023, pp.1938 - 1947, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| I See-Through You: A Framework for Removing Foreground Occlusion in Both Sparse and Dense Light Field Images Hur, Jiwan; Lee, Jae Young; Choi, Jaehyun; Kim, Junmo, 23rd IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2023, pp.229 - 238, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| Modality Mixer for Multi-modal Action Recognition Lee, Sumin; Woo, Sangmin; Park, Yeonju; Adi Nugroho, Muhammad; Kim, Changick, 23rd IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2023, pp.3297 - 3306, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| A Fast and Energy-Efficient Nanoelectromechanical Non-Volatile Memory for In-Memory Computing Lee, Yong-Bok; Gang, Min-Ho; Choi, Pan-Kyu; Kim, Su-Hyun; Kim, Tae-Soo; Lee, So-Young; Yoon, Jun-Bo, 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, pp.5 - 8, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| Localization using Multi-Focal Spatial Attention for Masked Face Recognition Cho, Yooshin; Cho, Hanbyel; Hong, Hyeong Gwon; Ahn, Jaesung; Cho, Dongmin; Chang, JungWoo; Kim, Junmo, 17th IEEE International Conference on Automatic Face and Gesture Recognition, FG 2023, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| FastSwap: A Lightweight One-Stage Framework for Real-Time Face Swapping Yoo, Sahng-Min; Choi, Tae-Min; Choi, Jae-Woo; Kim, Jong-Hwan, 23rd IEEE/CVF Winter Conference on Applications of Computer Vision, WACV 2023, pp.3547 - 3556, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| A Reliable Release Method for A Back-End-Of-Line Nems Switch of A Monolithic Three-Dimensional Integrated Cmos-Nems Circuit Kim, Tae-Soo; Lee, Yong-Bok; Lee, So-Young; Lee, Seung-Jun; Yoon, Jun-Bo, 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023, pp.76 - 79, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| Video Inference for Human Mesh Recovery with Vision Transformer Cho, Hanbyel; Ahn, Jaesung; Cho, Yooshin; Kim, Junmo, 17th IEEE International Conference on Automatic Face and Gesture Recognition, FG 2023, Institute of Electrical and Electronics Engineers Inc., 2023-01 |
| Accurate Stock Movement Prediction with Self-supervised Learning from Sparse Noisy Tweets Soun, Yejun; Yoo, Jaemin; Cho, Minyong; Jeon, Jihyeong; Kang, U, 2022 IEEE International Conference on Big Data, Big Data 2022, pp.1691 - 1700, Institute of Electrical and Electronics Engineers Inc., 2022-12-19 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Power Distribution Network Impedance Analysis considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, Keunwoo; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, SeongGuk; Park, Joonsang; Kim, Keunwoo; Choi, Namhyeon; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Toward Effective Deep Reinforcement Learning for 3D Robotic Manipulation: Multimodal End-to-End Reinforcement Learning from Visual and Proprioceptive Feedback Noh, Samyeul; Myung, Hyun, 36th Conference on Neural Information Processing Systems (NeurIPS 2022) Workshop, IEEE, 2022-12-09 |
| OutRAN: Co-optimizing for Flow Completion Time in Radio Access Network Kim, Jae Hong; Lee, Yunheon; Lim, Hwijoon; Jung, Youngmok; Kim, SongMin; Han, Dongsu, The 18th International Conference on emerging Networking EXperiments and Technologies, CoNEXT 2022, ACM, 2022-12-08 |
| CEO-MLCPP: Collision-Efficient and Obstacle-Aware Multi-Layer Coverage Path Planner for 3D Reconstruction with UAVs LEE, EUNGCHANG; Jung, Sungwook; SONG, SEUNGWON; Choi, Duckyu; Lee, Dongkyu; Lee, Seunghyun; Kim, Seoktae; et al, 10th International Conference on Robot Intelligence Technology and Applications (RiTA), pp.27 - 36, SPRINGER INTERNATIONAL PUBLISHING AG, 2022-12-07 |
| Parametric Surround modulation improves the robustness of the deep neural networks Lee, WooJu; Myung, Hyun, 10th International Conference on Robot Intelligence Technology and Applications (RiTA), pp.282 - 291, SPRINGER INTERNATIONAL PUBLISHING AG, 2022-12-07 |
| FARO-Tracker: Fast and Robust Target Tracking System for UAVs in Urban Environment Lee, Dongkyu; LEE, EUNGCHANG; Lim, HyungTae; SONG, SEUNGWON; Myung, Hyun, 10th International Conference on Robot Intelligence Technology and Applications (RiTA), pp.226 - 234, SPRINGER INTERNATIONAL PUBLISHING AG, 2022-12-07 |
| Low-Cost UWB-Based Relative Position Estimation for Cyber Physical Multi-Robot System Jeong, Myeongwoo; CHOI, JUNHO; Myung, Hyun, 10th International Conference on Robot Intelligence Technology and Applications (RiTA), pp.99 - 106, SPRINGER INTERNATIONAL PUBLISHING AG, 2022-12-07 |
| Performance Verification of Biomimetic Mole Robot (Mole-bot) for Efficient Underground Exploration LEE, JUN SEOK; Tirtawardhana, Christian; Myung, Hyun, 10th International Conference on Robot Intelligence Technology and Applications (RiTA), pp.321 - 330, SPRINGER INTERNATIONAL PUBLISHING AG, 2022-12-07 |
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