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Showing results 1 to 5 of 5

1
Co-modeling, experimental verification, and analysis of chip-package hierarchical power distribution network

Park, Hyun-Jeong; Kim, Hyung-Soo; Pak, Jun-So; Yoon, Chang-Wook; Koo, Kyoung-Choul; Kim, Joung-Ho, IEICE TRANSACTIONS ON ELECTRONICS, v.E91C, pp.595 - 606, 2008-04

2
Design and analysis of low-noise and low-power system-in-package (SiP) for Non-coherent Ultra Wide-Band (UWB) transceiver based on system model consisting of chip-package-PCB = 칩,패키지,PCB로 구성된 시스템모델을 바탕으로 비동기식 초광대역(UWB) 송수신기를 위한 저잡음, 저전력 SiP의 설계 및 분석link

Yoon, Chang-Wook; 윤창욱; et al, 한국과학기술원, 2010

3
Design of UWB transceiver SiP for short range communication = 근거리 통신에서의 사용을 위한 초광대역 송수신기 시스템의 설계link

Yoon, Chang-Wook; 윤창욱; et al, 한국과학기술원, 2007

4
Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Koo, Kyoung-Choul; Shim, Yu-Jeong; Yoon, Chang-Wook; Kim, Jae-Min; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.602 - 616, 2010-08

5
System-on-package ultra-wideband transmitter using CMOS impulse generator

Lee, Jun-Woo; Park, Young-Jin; Kim, Myung-Hoi; Yoon, Chang-Wook; Kim, Joung-Ho; Kim, Kwan-Ho, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.54, pp.1667 - 1674, 2006-04

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