Browse "School of Electrical Engineering(전기및전자공학부)" by Title 

Showing results 13421 to 13440 of 51626

13421
Design and analysis of low-noise and low-power system-in-package (SiP) for Non-coherent Ultra Wide-Band (UWB) transceiver based on system model consisting of chip-package-PCB = 칩,패키지,PCB로 구성된 시스템모델을 바탕으로 비동기식 초광대역(UWB) 송수신기를 위한 저잡음, 저전력 SiP의 설계 및 분석link

Yoon, Chang-Wook; 윤창욱; et al, 한국과학기술원, 2010

13422
Design and analysis of low-power, mismatch-tolerance SAR analog-to-digital converter = 공정 오류에 강인한 저전력 연속 근사 레지스터 아날로그 디지털 변환기의 설계 및 분석link

Lee, Young-Joo; 이영주; et al, 한국과학기술원, 2010

13423
Design and Analysis of LTE MIMO Handset Antenna with Enhanced Isolation using Decoupling Technique

Park, SeongOok, 2009 International Symposium on Antennas and Propagation, 2009-10-20

13424
Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC

Kim, Joungho, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2014-12-15

13425
Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC

Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11

13426
Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise

Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11

13427
Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs

Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26

13428
Design and Analysis of Position Tracking Observer Based on Instantaneous Power for Sensorless Drive of Permanent Magnet Synchronous Motor

Park, Jin-Sik; Jung, Shin-Myung; Kim, Hag-Wone; Youn, Myung-Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.27, no.5, pp.2585 - 2594, 2012-05

13429
Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module

Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01

13430
Design and analysis of quadrature coils for high-field NMR system = 강자장 핵자기 공명 단층 촬영기를 위한 쿼드러처 코일의 설계와 분석link

Lee, Seong-Sig; 이성식; et al, 한국과학기술원, 1986

13431
Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM)

Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; et al, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09

13432
Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module

Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15

13433
Design and analysis of ring resonator RF coils for high-field NMR imaging system = 강자장 핵자기 공명 단층 촬영기를 위한 환형 공진 고주파 코일의 설계와 분석link

Lee, Soo-Yeol; 이수열; et al, 한국과학기술원, 1985

13434
Design and analysis of signal and power integrity for multi-layer scramble PCB connecting different types of packages = 다중 패키지타입의 모바일 디램을 위한 스크램블회로기판의 신호 무결성과 전력 무결성 분석 및 설계에 대한 연구link

Kim, Taewon; Kim, Joungho; et al, 한국과학기술원, 2023

13435
Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test

Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19

13436
Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test

Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; et al, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27

13437
Design and analysis of six port-TEM cell for generating standard electromagnetic fields

Yun, JH; Lee, HyuckJae; Kim, JK, ELECTRONICS LETTERS, v.32, no.23, pp.2127 - 2128, 1996-11

13438
Design and analysis of spatially variant microns-array diffuser with uniform illumination for short-range infrared wireless-communications using photo

Lee, Man Seop, OPTICS COMMUNICATIONS, v.219, no.16, pp.49 - 55, 2003-03

13439
Design and Analysis of the Millimeter-Wave SPDT Switch for TDD Applications

Byeon, Chul-Woo; Park, Chul-Soon, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.61, no.8, pp.2858 - 2864, 2013-08

13440
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

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