25941 | Modeling and characterization of gas-phase etching of thermal oxide and TEOS oxide using anhydrous HF and CH3OH Lee, CS; Baek, JT; Yoo, Hyung Joun; Woo, Seong-Ihl, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.143, no.3, pp.1099 - 1103, 1996-03 |
25942 | Modeling and Characterization of the Detection and Suppression of Bogus Messages in Vehicular Ad Hoc Networks Ding, Qing; Wang, Jianfeng; Zhang, Xinming; Sung, Dan Keun, IEEE TRANSACTIONS ON MOBILE COMPUTING, v.22, no.10, pp.6027 - 6040, 2023-10 |
25943 | Modeling and characterization of Zinc Oxide thin film transistors = ZnO 박막트랜지스터의 특성화 및 모델링link Jang, Jin-Hyuk; 장진혁; et al, 한국과학기술원, 2009 |
25944 | Modeling and circuit design for intra-body power transfer = 체내전력전송을 위한 모델링과 회로 설계link Cho, Hyungjoo; Je, Minkyu; et al, 한국과학기술원, 2019 |
25945 | Modeling and computer simulation of ultrasound imaging systems and human tissue = 초음파 영상시스템 및 인체조직에 관한 모델링 및 컴퓨터 시뮬레이션link Lee, Bum-Suk; 이범석; et al, 한국과학기술원, 1989 |
25946 | Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; et al, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
25947 | Modeling and design of BGA type package for low inductance power/ground impedance and simultaneous switching noise = 전력 및 접지면에서 낮은 임피던스와 잡음을 갖는 볼 격자 배열 타입 패키지를 구현하기 위한 모델링과 디자인 방법에 관한 연구link Choi, Su-Na; 최수나; et al, 한국과학기술원, 2004 |
25948 | Modeling and design of flexible PCB coils and reliability study for flexible wireless power transfer systems = 유연한 무선 전력 전송 시스템을 위한 유연 PCB 코일의 모델링, 디자인 및 신뢰성 연구link Jeong, Seungtaek; Kim, Joungho; et al, 한국과학기술원, 2020 |
25949 | Modeling and Design of Multi-loop Controlled Series Regulator Kim, MG; Choi, HC; Youn, Myung Joong, pp.335 - 340, 1991-10 |
25950 | Modeling and design optimization of a wide-band passive equalizer and hybrid equalizer based on near-end crosstalk (NEXT) and reflections for high-speed serial links = 근단혼선과 반사현상을 이용한 고속직렬링크용 광대역 수동 이퀄라이저와 혼성 이퀄라이저의 모델링과 설계 최적화link Song, Eak-Hwan; 송익환; et al, 한국과학기술원, 2010 |
25951 | Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho; Shim, Yu-Jeong; Kim, Ga-Won, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.410 - 420, 2010-05 |
25952 | Modeling and experimental verification to investigate the effect of power supply noise imbalance on 900MHz differential LNA Koo, K.; Shim, J.; Shim, Y.; Kim, Joungho, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.343 - 346, IEEE, 2008-05-12 |
25953 | Modeling and improved current control of series resonant converter with nonperiodic integral cycle mode Ko, Jung Ho; Hong, Sung Soo; Kim, Marn Go; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.7, no.2, pp.280 - 288, 1992-04 |
25954 | Modeling and Improved Predictive Current Control for Buck-Boost Series Resonant Inverter Gun-Woo Moon; Jung-Hoon Lee; In-Cheol Baik; Kyeong-Hwa Kim; Myung-Joong Youn, JOURNAL OF ELECTICAL ENGINEERING AND INFORMATION SCIENCE, v.1, no.1, pp.51 - 57, 1996-02 |
25955 | Modeling and Inproved Current Control of Series Resonant Converter with Non-Periodic Integral Cycle Mode Ko, JH; Hong, SS; Kim, MG; Youn, Myung Joong, pp.745 - 751, 1991-06 |
25956 | Modeling and investigation of noise isolation in hierarchical power distribution network (PDN) for 3D system-in-package (SiP) = 3차원 시스템-인-패키지를 위한 계층적 전력 분배망의 잡음 분리에 관한 모델링 및 연구link Park, Hyun-Jeong; 박현정; et al, 한국과학기술원, 2009 |
25957 | Modeling and measurement analysis of through silicon via (TSV) and defects = 실리콘 관통 비아 및 결함의 모델링과 측정 분석link Jung, Daniel Hyun-Suk; 정현석; et al, 한국과학기술원, 2013 |
25958 | Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 |
25959 | Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test Park, Jun Yong; Kim, Hye Soo; Won, Hyo Sup; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Michael; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25 |
25960 | Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model Kim, Jae-Min; Jeong, You-Chul; Lee, Jun-Ho; Ryu, Chung-Hyun; Shim, Jong-Joo; Shin, Min-Chul; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, pp.544 - 557, 2008-08 |