Browse "School of Electrical Engineering(전기및전자공학부)" by Subject flip-chip bonding
Showing results 1 to 2 of 2
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
Discover
Open Access
- 573 OA Article
Date issued
- 5,420 2020 - 2024
- 18,944 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989