Browse "School of Electrical Engineering(전기및전자공학부)" by Subject flip-chip bonding

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1
Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02

2
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08

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