Browse "School of Electrical Engineering(전기및전자공학부)" by Subject TSVs
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| Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages Kumar, Gokul; Sitaraman, Srikrishna; Cho, Jonghyun; Sundaram, Venky; Kim, Joungho; Tummala, Rao R, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.1, pp.87 - 99, 2016-01 |
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