Browse "School of Electrical Engineering(전기및전자공학부)" by Subject SPIRAL INDUCTORS
Showing results 1 to 4 of 4
| 3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology Yoon, Jun-Bo; Kim, BI; Choi, YS; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01 |
| High Performance RFIPDs on Thick Oxide Substrate using Cu-BCB Process inho jeong; ki-joong kim; tong-ook kong; jun-seok kim; hyung-kyu choi; choong-mo nam; dong-wook kim; et al, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.37, no.1, pp.49 - 52, 2003-04 |
| Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates Kim, Cheol Ho; Kwon, Young-Se, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08 |
| Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC Koo, Kyoung-Choul; Kim, Myung-Hoi; Kim, Jonghoon J.; Kim, Joung-Ho; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.3, pp.476 - 488, 2013-03 |
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