Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Ni/Au bump

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Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

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