Showing results 1 to 13 of 13
3.125-to-28.125 Gb/s 4.72 mW/Gb/s Multi- Standard Parallel Transceiver Supporting Channel-Independent Operation in 40-nm CMOS Yoon, Jong-Hyeok; Kwon, Kyeongha; Bae, Hyeon-Min, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.67, no.8, pp.2647 - 2658, 2020-08 |
A 0.5-V Sub-10-mu W 15.28-m Omega/root Hz Bio-Impedance Sensor IC With Sub-1 degrees Phase Error Kim, Kwantae; Kim, Ji-Hoon; Gweon, Surin; Kim, Minseo; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.55, no.8, pp.2161 - 2173, 2020-08 |
A 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC Kim, Ki-Duk; Park, Seunghyun; Lee, Byunghun; Lee, Hyung-Min; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.69, no.8, pp.8604 - 8608, 2022-08 |
A Multimodal Neural-Recording IC With Reconfigurable Analog Front-Ends for Improved Availability and Usability for Recording Channels Lee, Taeju; Kim, Mi Kyung; Lee, Hyunjoo Jenny; Je, Minkyu, IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS, v.16, no.2, pp.185 - 199, 2022-04 |
A Reconfigurable Neural Stimulation IC With a High-Resolution Strength Control and In-Situ Neural Recording Function for Cochlear Implant Systems Ahn, Woojin; Kim, Doohee; Park, Jonghyeok; Park, Joeng Hoan; Lee, Taeju; Jeong, Kyeongwon; Min, Kyou Sik; et al, IEEE SOLID-STATE CIRCUITS LETTERS, v.5, pp.162 - 165, 2022 |
A Wide-Bandwidth Ultrasound Receiver and On-Chip Ultrasound Transmitter for Ultrasound Capsule Endoscopy Jeong, Kyeongwon; Yun, Gichan; Choi, Jaesuk; Choi, Injun; Son, Jeehoon; Hwang, Jae Youn; Ha, Sohmyung; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.58, no.10, pp.2778 - 2789, 2023-10 |
Application of Pulsed Green Laser Activation to Top-Tier MOSFET Fabrication for Monolithic 3-D Integration Park, Youngkeun; Jeong, Jaejoong; Noh, Semin; Kim, Heetae; Kim, Seongho; Kim, Kiryong; Kim, Dongbin; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.71, no.1, pp.890 - 895, 2024-01 |
Design of Sub-10-mu W Sub-0.1% THD Sinusoidal Current Generator IC for Bio-Impedance Sensing Kim, Kwantae; Kim, Sangyeob; Yoo, Hoi-Jun, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.57, no.2, pp.586 - 595, 2022-02 |
Millimeter-Wave Frequency Reconfigurable Dual-Band CMOS Power Amplifier for 5G Communication Radios Lee, Jaehun; Paek, Ji-Seon; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.1, pp.801 - 812, 2022-01 |
MMSE-Interference Canceling Receiver for QAM-FBMC Systems Han, Hyungsik; Kwon, Girim; Park, Hyuncheol, IEEE COMMUNICATIONS LETTERS, v.24, no.11, pp.2589 - 2593, 2020-11 |
NEW HARDWARE ARCHITECTURE FOR FAST RASTER IMAGE GENERATION KIM, SS; EO, KS; Kyung, Chong-Min, ELECTRONICS LETTERS, v.24, no.7, pp.382 - 383, 1988-03 |
Radiation-Hardened Sensor Interface Circuit for Monitoring Severe Accidents in Nuclear Power Plants Jeon, Hyuntak; Kwon, Inyong; Je, Minkyu, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.67, no.7, pp.1738 - 1745, 2020-07 |
Time-Multiplexed PWM LED Driver With Grayscale Enhancement Techniques for Signage Display Kim, Ji-Hwan; Kim, Jang-Su; Kim, Jusung; Lee, Sang-Gug, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.69, no.6, pp.6410 - 6419, 2022-06 |
Discover