Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Flip-chip bonding
Showing results 1 to 3 of 3
| 2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications Ukaegbu, Ikechi Augustine; Kim, Do-Won; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon, IEEE PHOTONICS TECHNOLOGY LETTERS, v.23, no.19, pp.1403 - 1405, 2011-10 |
| Performance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects Ukaegbu, Ikechi Augustine; Kim, Do-Won; Shirazy, Mohammed Shorab Muslim; Lee, Tae-Woo; Cho, Mu-Hee; Park, Hyo-Hoon, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.5, pp.740 - 748, 2013-05 |
| 하이브리드 적외선 감지 소자를 위한 인듐 범프의 연구 = The study of indium bump for hybrid infrared focal plane arraylink 최종화; Choi, Jong-Hwa; et al, 한국과학기술원, 1997 |
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