Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Equivalent circuit model
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| Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10 |
| Modeling and measurement analysis of through silicon via (TSV) and defects = 실리콘 관통 비아 및 결함의 모델링과 측정 분석link Jung, Daniel Hyun-Suk; 정현석; et al, 한국과학기술원, 2013 |
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