Showing results 4 to 6 of 6
BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems Wang, Chao; Zhou, Jun; Weerasekera, Roshan; Zhao, Bin; Liu, Xin; Royannez, Philippe; Je, Minkyu, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.62, no.1, pp.139 - 148, 2015-01 |
Fast and energy-efficient low-voltage level shifters Zhou, Jun; Wang, Chao; Liu, Xin; Je, Minkyu, MICROELECTRONICS JOURNAL, v.46, no.1, pp.75 - 80, 2015-01 |
Near-Threshold Energy- and Area-Efficient Reconfigurable DWPT/DWT Processor for Healthcare-Monitoring Applications Wang, Chao; Zhou, Jun; Liao, Lei; Lan, Jingjing; Luo, Jianwen; Liu, Xin; Je, Minkyu, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.62, no.1, pp.70 - 74, 2015-01 |
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