Browse "School of Electrical Engineering(전기및전자공학부)" by Author Yoon, Alexander

Showing results 1 to 12 of 12

1
Conformal, Wafer-Scale and Controlled Nanoscale Doping of Semiconductors Via the iCVD Process

Kim, Jaehwan; Park, Hongkeun; Pak, Kwanyong; Yoon, Alexander; Kim, Yun Sang; Im, Sung Gap; Hwang, Wan Sik; et al, 2018 Symposia on VLSI Technology and Circuits, VLSI, 2018-06

2
Conformal, Wafer-Scale and Controlled Nanoscale Doping of Semiconductors Via the iCVD Process

Kim, Jae Hwan; Park, Hongkeun; Pak, Kwanyong; Yoon, Alexander; Kim, Yun Sang; Im, Sung Gapresearcher; Hwang, Wan Sik; et al, 64th IEEE International Electron Devices Meeting (IEDM 2018), IEEE, 2018-12-04

3
Facile graphene n-doping by wet chemical treatment for electronic applications

Bong, Jae Hoon; Sul, One Jae; Yoon, Alexander; Choi, Sung-Yoolresearcher; Cho, Byung Jinresearcher, NANOSCALE, v.6, no.15, pp.8503 - 8508, 2014-08

4
Graphene as an Ultrathin Diffusion Barrier for Advanced Cu Metallization

Bong, Jae Hoon; Yoon, Seong Jun; Yoon, Alexander; Hwang, Wan Sik; Cho, Byung-Jinresearcher, Graphene Week 2015, Graphene Week 2015, 2015-06-24

5
Graphene based Cu diffusion barrier

김재환; 윤성준; 봉재훈; Yoon, Alexander; 조병진researcher, 24th Korean Conference on Semiconductors, SK Hynix, 2017-02-15

6
Improved Electromigration-Resistance of Cu Interconnects by Graphene-Based Capping Layer

Yoon, Seong Jun; Yoon, Alexander; Hwang, Wan Sik; Choi, Sung-Yool; Cho, Byung-Jinresearcher, 2015 Symposium on VLSI Technology, 2015 Symposium on VLSI Technology, 2015-06-15

7
Large Grain Ruthenium for Alternative Interconnects

Yoon, Seong Jun; Lee, SangJae; Lee, Tae In; Yoon, Alexander; Cho, Byung-Jinresearcher, IEEE ELECTRON DEVICE LETTERS, v.40, no.1, pp.91 - 94, 2019-01

8
PVP/GO:Graphene/polymer composite film as a Cu diffusion barrier

Kim, Jae Hwan; Yoon, Seong Jun; Bong, Jae Hoon; Yoon, Alexander; Cho, Byung Jinresearcher, The 8th International Conference on Recent Progress in Graphene/2D Research, SKKU Advanced Institute of Nano Technology, 2016-09-27

9
Selective Pore-Sealing of Highly Porous Ultralow-k dielectrics for ULSI Interconnects by Cyclic Initiated Chemical Vapor Deposition Process

Yoon, Seong Jun; Pak, Kwanyong; Ahn, Hyun Jun; Yoon, Alexander; Im, Sung Gapresearcher; Cho, Byung Jinresearcher, 38th IEEE Symposium on VLSI Technology, pp.73 - 74, IEEE, 2018-06

10
Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (< 2 nm) Polymer Coating

Yoon, Seong Jun; Pak, Kwanyong; Taewook Nam; Yoon, Alexander; Kim, Hyungjun; Im, Sung Gapresearcher; Cho, Byung Jinresearcher, ACS NANO, v.11, no.8, pp.7841 - 7847, 2017-08

11
Ultrathin graphene and graphene oxide layers as a diffusion barrier for advanced Cu metallization

Bong, Jae Hoon; Yoon, Seong Jun; Yoon, Alexander; Hwang, Wan Sik; Cho, Byung-Jinresearcher, APPLIED PHYSICS LETTERS, v.106, no.6, 2015-02

12
개시제를 통한 고분자 기상증착기법을 활용한 다공성 초절연물질 (k = 2.0) 표면 실링 방법

윤성준; 박관용; 남태욱; Yoon, Alexander; 김형준; 임성갑researcher; 조병진researcher, 24th Korean Conference on Semiconductors, SK Hynix, 2017-02-15

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