Browse "School of Electrical Engineering(전기및전자공학부)" by Author Venky Sundaram,
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| Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC Kim, Joungho; Insu Hwang; Youngwoo Kim; Jonghyun Cho; Venky Sundaram,; Rao Tummala, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
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