Browse "School of Electrical Engineering(전기및전자공학부)" by Author Song, Eunseok
Showing results 1 to 6 of 6
| Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs Song, Eunseok; Koo, Kyoungchoul; Kim, Myunghoi; Park, Jun So; Kim Joungho, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Measurement and Analysis of Voltage Transfer Ratio (VTR) of Package-level WPT considering PDN Conditions Kim, Joungho; Song, Eunseok; Kim, Hongseok; Kim, Jonghoon J; Kim, Jiseong, 2013 Asia-Pacific EMC, 2013 Asia-Pacific EMC, 2013-05-20 |
| Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC Kim, Joung-Ho; Song, Eunseok; Jung, Daniel H.; Kim, Youngwoo, 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014 International Symposium on Electromagnetic Compatability, Tokyo(EMC2014), 2014-05-15 |
| Multi-helix inductor of wireless power transfer system for 3-D stacked package Song, Eunseok; Kim, Jong Hoon; Kim, Joungho, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, pp.43 - 46, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11 |
| TSV-based Decoupling Capacitor Schemes in 3D-IC Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance Kim, Joungho; Song, Eunseok; Kim, Hongseok; Song, Chiuk; Kim, Jonghoon J, 2013 IEEE Electrical Design of Advanced Packaging and Systems, 2013 IEEE Electrical Design of Advanced Packaging and Systems, 2013-12-13 |
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