Browse "School of Electrical Engineering(전기및전자공학부)" by Author Song, Eak-Hwan
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| A Compact and Wide-Band Passive Equalizer Design Using a Stub With Defected Ground Structure for High Speed Data Transmission Shim, Yu-Jeong; Lee, Woo-Jin; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.20, pp.256 - 258, 2010-05 |
| A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Lee, Woo-Jin; Shin, Min-Chul; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.18, no.12, pp.794 - 796, 2008-12 |
| A Wideband and Compact Partial Electromagnetic Bandgap Structure With a Narrow Via Pitch for a Signal Via Shield Hwang, Chul-Soon; Kim, Jae-Min; Song, Eak-Hwan; Shim, Yu-Jeong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.1, pp.241 - 244, 2011-02 |
| Estimation of data-dependent jitter using single pulse analysis method in high-speed interconnects = 단일비트응답 분석을 통한 고속신호 전송선에서의 신호의존지터 예측link Song, Eak-Hwan; 송익환; et al, 한국과학기술원, 2006 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Young; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08 |
| Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package Shim, Yu-Jeong; Park, Jong-Bae; Kim, Jae-Min; Song, Eak-Hwan; Yoo, Jeong-Sik; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.51, no.3, pp.763 - 773, 2009-08 |
| Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
| Modeling and design optimization of a wide-band passive equalizer and hybrid equalizer based on near-end crosstalk (NEXT) and reflections for high-speed serial links = 근단혼선과 반사현상을 이용한 고속직렬링크용 광대역 수동 이퀄라이저와 혼성 이퀄라이저의 모델링과 설계 최적화link Song, Eak-Hwan; 송익환; et al, 한국과학기술원, 2010 |
| Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Joung-Ho; Shim, Yu-Jeong; Kim, Ga-Won, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.410 - 420, 2010-05 |
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