Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, Kun-Woo
Showing results 1 to 7 of 7
| A 1.5-MHz BW 81.2-dB SNDR Dual-Residue Pipeline ADC With a Fully Dynamic Noise-Shaping Interpolating-SAR ADC Chung, Jae-Hyun; Kim, Ye-Dam; Park, Chang-Un; Park, Kun-Woo; Oh, Dong-Ryeol; Seo, Min-Jae; Ryu, Seung-Tak, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.59, no.8, pp.2481 - 2491, 2024-08 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| Measurement and Analysis of a High-Speed TSV Channel Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Myung-Hoi; Kim, Ki-Yeong; Lee, Jun-Ho; Lee, Hyung-Dong; Park, Kun-Woo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.10, pp.1672 - 1685, 2012-10 |
| Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects Kim, Ki-Yeong; Hwang, Chul-Soon; Koo, Kyoung-Choul; Cho, Jong-Hyun; Kim, Hee-Gon; Kim, Joung-Ho; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2057 - 2070, 2012-12 |
| Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
| PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Young; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02 |
| Robust multi-stage noise shaping (R-MASH) architecture assisted by subrange SAR ADC = 부분 범위 축차 비교형 아날로그 디지털 변환기를 사용한 견고 다단 잡음 정형 구조link Park, Kun-Woo; Ryu, Seung-Tak; et al, 한국과학기술원, 2022 |
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