Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, K.
Showing results 1 to 23 of 23
| A 10 bit piecewise linear cascade interpolation DAC with loop gain ratio control Lee, S.; Kim, K.; Park, K.; Park, C.; Lee, B.; Jeon, J.; Huh, J.; et al, 32nd Annual Custom Integrated Circuits Conference - The Showcase for Circuit Design in the Heart of Silicon Valley, CICC 2010, CICC 2010, 2010-09-19 |
| A 159.2mW SoC implementation of T-DMB receiver including stacked memories Lee, J.; Kim, S.; Kim, J.; Kim, D.; Kwon, Y.; Choi, M.; Park, K.; et al, IEEE 2008 Custom Integrated Circuits Conference, CICC 2008, pp.679 - 682, IEEE, 2008-09-21 |
| A computationally efficient stack-based iterative precoding for multiuser MIMO broadcast channel Park, K.; Cha, J.; Kang, Joonhyuk, 68th Semi-Annual IEEE Vehicular Technology, VTC 2008-Fall, Conference, IEEE, 2008-09-21 |
| A fast 4x4 intra mode decision for inter frame coding in H.264|MPEG-4 Part 10 Na, T.; Kim, MunChurl; Hahm, S.; Park, C.; Park, K., IEEE International Symposium on Broadband Multimedia Systems and Broadcasting 2008, Broadband Multimedia Symposium 2008, BMSB, 2008-03-31 |
| A fast mode selection scheme in inter-layer prediction of H.264 scalable extension coding Lee, B.; Kim, MunChurl; Hahm, S.; Park, C.; Park, K., IEEE International Symposium on Broadband Multimedia Systems and Broadcasting 2008, Broadband Multimedia Symposium 2008, BMSB, 2008-03-31 |
| Adaptive stack-based iterative precoding for the multiuser mimo downlink Park, K.; Cha, J.; Kang, Joonhyuk, 2008 IEEE 19th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC 2008, IEEE, 2008-09-15 |
| An efficient block mode decision for temporal scalability in scalable video coding 68220L Lee, B.; Kim, MunChurl; Hahm, S.; Park, C.; Park, K., Visual Communications and Image Processing 2008, v.6822, pp.68220L -, SPIE, 2008-01-29 |
| Analysis of power distribution network in TSV-based 3D-IC Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25 |
| Fast all-zero block detection based on classification approach Chang, Y.; Kim, MunChurl; Hahm, S.; Park, C.; Park, K., Australian Pattern Recognition Society (APRS), pp.267 - 273, 2007-12-03 |
| Fast frequency acquisition phase frequency detectors with prediction-based edge blocking Park, K.; Park, In-Cheol, 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009, pp.1891 - 1894, IEEE, 2009-05-24 |
| Guard ring effect for Through Silicon Via (TSV) noise coupling reduction Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; et al, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC Kim, Joungho; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25 |
| Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 |
| Implementation on a real-time SVC encoder for mobile broadcasting Hahm, S.; Park, C.; Park, K.; Kim, MunChurl, 2008 5th IEEE Consumer Communications and Networking Conference, CCNC 2008, pp.1236 - 1237, 2008-01-10 |
| Low-complexity tone reservation method for papr reduction of OFDM systems Park, K.; Park, In-Cheol, 2010 IEEE International Symposium on Circuits and Systems: Nano-Bio Circuit Fabrics and Systems, ISCAS 2010, pp.2147 - 2150, IEEE, 2010-05-30 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and measurement of radiated emission through a cutout on the power/ground plane Lee, J.; Kang, J.; Park, K.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.776 - 780, IEEE, 2006-08-14 |
| Optical performance monitoring techniques based on pilot tones for WDM network applications Ji, H.; Park, K.; Lee, J.; Chung, H.; Son, E.; Han, K.; Jun, S.; et al, JOURNAL OF OPTICAL NETWORKING, v.3, no.7, pp.510 - 533, 2004 |
| QRD-M based iterative precoding for multi-user broadcast channel Park, K.; Cha, J.; Kang, Joonhyuk, EW2008 - 14th European Wireless Conference 2008, 2008-06-22 |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 |
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