Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, Junyong
Showing results 1 to 43 of 43
| A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias Park, Junyong; Jung, Daniel H.; Kim, Byunggon; Choi, Sumin; Kim,Youngwoo; Park,Shinyoung; Park,Gapyeol; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.4, pp.1198 - 1206, 2019-08 |
| A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10 |
| A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis Lho, Daehwan; Park, Junyong; Park, Hyunwook; Park, Shinyoung; Kim, SeongGuk; Kang, Hyungmin; Kim, Subin; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor Kim, Dong-Hyun; Kim, Subin; Park, Junyong; Kim, Youngwoo; Choi, Sumin; Cho, Kyungjun; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.40 - 40, IEEE EMC & APEMC, 2018-05-16 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Subin; Kang, Hyungmin; Sim, Boogyo; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02 |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; et al, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27 |
| Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; et al, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16 |
| Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket Park, Junyong; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM4 Signal on Stacked Through-Silicon Vias (TSVs) Park, Junyong; Kim, Jonghoon J.; Choi, Sumin; Kim, Youngwoo; Kim, Joungho; Kim, Heegon, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1724 - 1731, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Eye-diagram estimation with decision feedback equalizer for encoded and modulated data bit patterns = 부호화 및 변조된 데이터 비트 패턴에 대한 결정 재입력 등호기가 결합된 아이-다이어그램 예측 기법link Park, Junyong; 박준용; et al, 한국과학기술원, 2016 |
| Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel Park, Junyong; Kim, Dong-Hyun; Kim, Youngwoo; Choi, Sumin; Kim, Joungho, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), IEEE EMC & APEMC, 2018-05-16 |
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 |
| Fast and accurate bit probability density function (PDF)-based eye diagram estimation method for high-speed systems = 고속 시스템에 대한 비트 확률분포함수 기반의 빠르고 정확한 통계적 아이 다이어그램 추정 방법link Park, Junyong; Kim, Joungho; et al, 한국과학기술원, 2019 |
| Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; Park, Hyunwook; Park, Junyong; Lee, Seongsoo; Shim, Daeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09 |
| Generator Polynomial Model-Based Eye Diagram Estimation Method for Bose-Chaudhuri-Hocquenghem (BCH) Code and Reed-Solomon (RS) Code Park, Junyong; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.62, no.1, pp.240 - 248, 2020-02 |
| Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Measurement of High-bandwidth and High-density Silicone Rubber Socket up to 110GHz Park, Junyong; Kim, Joungho; Kim, Hyesoo; Kim, Jonghoon J; Bae, Bumhee; Ha, Dongho; Bae, Michael, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling Park, Junyong; Park, Shinyoung; Kim, Youngwoo; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1867 - 1875, 2019-12 |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 |
| Signal Integrity Analysis of High Speed Connector for Multi-Media System Kim, Joungho; Song, Huijin; Kim, Jonghoon; Park, Junyong; Lee, Junho; Choi, Seongmin, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects Choi, Sumin; Park, Junyong; Jung, Daniel H.; Kim, Joungho; Kim, Heegon; Kim, Kiyeong, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2139 - 2144, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08 |
| Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01 |
| Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
| Statistical Eye-Diagram Estimation Method for High Speed Channel with N-Tap Decision Feedback Equalizer (DFE) Park, Junyong; Song, Huijin; Kim, Dong-Hyun; Choi, Sumin; Kim, Joungho, Joint 60th IEEE International Symposium on Electromagnetic Compatibility (EMC) / IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), pp.1027 - 1032, IEEE, 2018-05 |
| Statistical Eye-Diagram Estimation Method for High-Speed Channel with N-Tap Decision Feedback Equalizer (DFE) Kim, Joungho; Park, Junyong; Song, Huijin; Kim, Dong-Hyun; Choi, Sumin, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), IEEE EMC & APEMC, 2018-05-16 |
| Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
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