Browse "School of Electrical Engineering(전기및전자공학부)" by Author Jun So Pak
Showing results 1 to 5 of 5
| Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling Kim, Joungho; Heegon Kim; Sukjin Kim; Changhyun Ch; Daniel H. Jung; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Design and Characterization of Magnetically Coupled On-Chip Current Probe for Monitoring Switching Current in Chip I/O PDN Kim, Joungho; Jonghoon J. Kim; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12 |
| Disconnection failure model and analysis of TSV-based 3D ICs Kim, Joungho; Joohee Kim; Heegon Kim; Jonghoon J. Kim; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Measurement-based Signal Quality Test of High-speed TSV Channel Kim, Joungho; Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J; Jun So Pak, 2012 International Microelectronics and Packaging Society, IEEE, 2010-09-14 |
| Protection of a Delay-Locked Loop from Simultaneous Switching Noise Coupling using an On-Chip Electromagnetic Bandgap Structure Kim, Joungho; Kiyeong Kim; Chulsoon Hwang; Jun So Pak, 2012 IEEE Electromagnetic Compatibility Symposium, IEEE, 2012-08-15 |
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