Showing results 1 to 9 of 9
A MLGA Connector for High speed and High Density Kim, Joungho; Kim, Young Soo; Choi, Hyung Seok; Ko, Youngwoo; Bang, Hyo Jae; Kim, Woo Kyung; Baek, Seungyong; et al, HD International 2001 (The International Conference and Exhibition on High Density Interconnect and Systems packaging), 2001 |
A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
Compensation of ESD and Device Input Capacitance by using Embedded Inductor on PCB Substrate for 3 Gbps SerDes Applications Ahn, Seungyoung; Baek, Seungyong; Lee, Junho; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, pp.499 - 504, IEEE, 2004-08-09 |
Compensation of unbalanced capacitive crosstalk noise in category-SE modular jack using balancing capacitor in PCB Kim, Joungho; Kim, Namhoon; Sung, Myunghee; Kim, Yhungsoo; Baek, Seungyong; Ryu, Woonghwan, EPEP2000, IEEE, 2000-10 |
Design and estimation of embedded passives in multiple line grid array (MLGA) package Kim, Joungho; Lee, Junho; Ahn, Seungyoung; Baek, Seungyong; Kim, Young-Soo; Yoon, Chong K., EMAP2000, EMAP, 2000-11 |
Low noise THz Emitter Using Lift-off LT-GaAs Thin Film Sitch on Fused Silica Kim, Joungho; Baek, Seungyong; Lee, Jongjoo; Ryu, Jaeyoung; Jung, Yuchul; Lee, Heeseok, International Terahertz workshop 2000, 2000 |
Micromachined picosecond optical near-field probe for purse-coupling measurement of interconnection lines Kim, Joungho; Lee, Jongjoo; Lee, Heeseok; Baek, Seungyong; Jung, Yuchul, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP2000, pp.185 - 188, IEEE, 2000-10 |
Open Load Backward Matching (OLBM) Technique for Low ISI Differential H-tree Clock and Data Transmission Chung, Daehyun; Baek, Seungyong; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.269 - 272, IEEE, 2003-10-27 |
Separation of Reflections and Noises from THz measurement Using Independent Component Analysis (ICA) Kim, Joungho; Jung, Youchul; Ryu, Jaeyoung; Lee, Jongjoo; Baek, Seungyong, International Terahertz workshop 2000, 2000 |
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