Showing results 1 to 5 of 5
Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards Kim, Joungho; Rotaru, MD; Baek, S; Park, J; Yer, MK, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.319 - 330, 2006-05 |
Modeling and measurement of mode-conversion and frequency dependent loss in high-speed differential interconnections on multilayer PCB Baek, S; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E88C, pp.1992 - 2000, 2005-10 |
Over GHz Frequency Model of Commercial 2mm Hard Metric Connector using On-board Calibration Standards Kim, Joungho; Baek, S; Park, BC; Kam, DG, IEEE 4th Electronics Packaging Technology Conference, pp.189 - 193, IEEE, 2002-12 |
Pulse-coupling measurement of coupled microstrip lines using a micromachined picosecond optical near-field probe Lee, J; Lee, H; Baek, S; Jeong, YC; Kim, Joungho, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.49, no.10, pp.1740 - 1746, 2001-10 |
Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection Kim, N; Sung, M; Kim, H; Baek, S; Ryu, W; An, JG; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.24, no.3, pp.260 - 267, 2001-08 |
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