Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 37221 to 37240 of 51619
| Thermal Noise Model for Short-Channel MOSFETs Han, Kwangseok; Shin, Hyungcheol; Lee, Kwyro, The 10th Korean Conference on Semiconductors, The 10th Korean Conference on Semiconductors, 2003-02 |
| Thermal Noise Modeling for Short - Channel MOSFET's Lee, Kwyro; Shin, Hyung-Cheol; Han, Kwangseok, International Conference on Simulation of Semiconductor Processes and Devices(SISPAD), pp.79 - 82, 2003 |
| Thermal Runaway of Silicon-Based Laser Sails Holdman, Gregory R.; Jaffe, Gabriel R.; Feng, Demeng; Jang, Min Seok; Kats, Mikhail A.; Brar, Victor W., ADVANCED OPTICAL MATERIALS, v.10, no.19, 2022-07 |
| Thermal signature: a simple yet accurate thermal index for floorplan optimization Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08 |
| Thermal Signature: An Accurate and Fast Thermal Model = Thermal Signature: 정확하고 빠른 온도 지표link Kung, Jae-Ha; 궁재하; et al, 한국과학기술원, 2012 |
| Thermal signature: 자동 floorplanning을 위한 빠르고 정확한 온도 지표 신영수, 한국반도체학술대회, 한국반도체학회, 2011 |
| THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09 |
| Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
| Thermal stability of (HfO2)(x)(Al2O3)(1-x) on Si Yu, HY; Wu, N; Li, MF; Zhu, CX; Cho, Byung Jin; Kwong, DL; Tung, CH; et al, APPLIED PHYSICS LETTERS, v.81, no.19, pp.3618 - 3620, 2002-11 |
| Thermal Stability of ALD-HfO(2)/GaAs Pretreated with Trimethylaluminium Byun, YC (Byun, Young-Chul); An, CH (An, Chee-Hong); Lee, Seok-Hee; Cho, MH (Cho, Mann-Ho); Kim, H (Kim, Hyoungsub), JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.159, no.1, pp.6 - 10, 2012 |
| Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05 |
| Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion Jeong, Jaeyong; Kim, Seongkwang; Suh, Yoonje; Shim, Joonsup; Beak, Woo Jin; Choi, Sung Joon; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024-06 |
| Thermal transmission line (TTL) and fluidic through silicon via (F-TSV) based embedded cooling structure for high bandwidth memory (HBM) module considering signal and thermal integrity (STI) = 신호 무결성 및 열 무결성을 고려한 고대역폭 메모리 모듈을 위한 열 전송 선로와 유체 흐름용 실리콘 관통 비아 기반 내장형 냉각 구조 설계link Son, Keeyoung; Kim, Joungho; et al, 한국과학기술원, 2021 |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; et al, DesignCon 2022, IEEE, 2022-04-07 |
| Thermal transport properties of thin films of small molecule organic semiconductors Kim, N; Domercq, B; Yoo, Seunghyup; Christensen, A; Kippelen, B; Graham, S, APPLIED PHYSICS LETTERS, v.87, no.24, 2005-12 |
| Thermal-aware energy minimization of 3D-stacked L2 cache through DVFS = 동적 전압 / 주파수 조절을 통한 3차원 적층 캐쉬의 열을 고려한 에너지 최소화link Yun, Woo-Jin; 윤우진; et al, 한국과학기술원, 2012 |
| Thermal-aware energy minimization of 3D-stacked L3 cache with error rate limitation Yun, W.; Kang, K.; Kyung, Chong-Min, 2011 IEEE International Symposium of Circuits and Systems, ISCAS 2011, pp.1672 - 1675, IEEE, 2011-05-15 |
| Thermal-aware time budgeting for hierarchical VLSI designs = 온도를 고려한 계층적 VLSI 설계의 시간 분배 기법link Jung, Min-Wook; 정민욱; et al, 한국과학기술원, 2010 |
| Thermal-Infrared based Drivable Region Detection Yoon, Jaeshin; Park, Kibaek; Hwang, Soonmin; Kim, Namil; Choi, Yukyung; Rameau, Francois; Kweon, In So, 2016 IEEE Intelligent Vehicles Symposium, pp.978 - 985, 2016 IEEE Intelligent Vehicles Symposium, 2016-06-21 |
| Thermal-Variation Insensitive Force-Touch Sensing System Using Transparent Piezoelectric Thin-Film Kim, Min-Woo; Kim, Dong-Kyu; Kodani, Tetsuhiro; Kanemura, Takashi; Gwon, Hui Dong; Cho, Gyu-Hyeong; Han, Kwan-Young; et al, IEEE SENSORS JOURNAL, v.18, no.14, pp.5863 - 5875, 2018-07 |
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