Showing results 37221 to 37240 of 51627
Thermal image enhancement using convolutional neural network Choi, Yukyung; Kim, Namil; Hwang, Soonmin; Kweon, In-So, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2016), IEEE Robotics and Automation Society (RAS), 2016-10-11 |
Thermal imaging applications using polydiacetylene supramolecules = Polydiacetylene Supramolecule 를 이용한 열적 구동 이미징 시스템의 응용link Yarimaga, Oktay; Choi, Yang-Kyu; et al, 한국과학기술원, 2010 |
Thermal Improvement for 2.75 GHz-FBAR Devices Yoon, Giwan; Linh, Mai; Lee, Jae-young; Pham, Van-Su; Kabir, S. M. Humayun; Dang, Hoai-Bac, 한국해양정보통신학회 추계종합학술대회 , pp.196 - 199, 한국해양정보통신학회, 2007-10 |
Thermal instability of effective work function in metal/high-kappa stack and its material dependence Joo, MS; Cho, Byung Jin; Balasubramanian, N; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.11, pp.716 - 718, 2004-11 |
Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 전자공학회지, v.36, no.9, pp.980 - 990, 2009-09 |
Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 3차원반도체집적기술 특집, 전자공학회지, 2009-09 |
Thermal Management of Gallium-based Transformative Electronics through Integration of a Stretchable Radiative Cooler for Reliable Stiffness Tuning in Hot Outdoors Byun, Sanghyuk; Yun, Joo Ho; Heo, Se-Yeon; Shi, Chuanqian; Lee, Gil Ju; Agno, Karen-Christian; Jang, Kyung-In; et al, 2022 MRS Fall Meeting, Materials Research Society, 2022-11-28 |
Thermal modeling of heterojunction bipolar transistors with pulsed I-V measurements Park, Hyun-Min; Jeon, Kye-Ik; Hong, Songcheol, MICROWAVE JOURNAL, v.44, no.3, pp.128 - 128, 2001-03 |
Thermal Noise Model for Short-Channel MOSFETs Han, Kwangseok; Shin, Hyungcheol; Lee, Kwyro, The 10th Korean Conference on Semiconductors, The 10th Korean Conference on Semiconductors, 2003-02 |
Thermal Noise Modeling for Short - Channel MOSFET's Lee, Kwyro; Shin, Hyung-Cheol; Han, Kwangseok, International Conference on Simulation of Semiconductor Processes and Devices(SISPAD), pp.79 - 82, 2003 |
Thermal Runaway of Silicon-Based Laser Sails Holdman, Gregory R.; Jaffe, Gabriel R.; Feng, Demeng; Jang, Min Seok; Kats, Mikhail A.; Brar, Victor W., ADVANCED OPTICAL MATERIALS, v.10, no.19, 2022-07 |
Thermal signature: a simple yet accurate thermal index for floorplan optimization Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08 |
Thermal Signature: An Accurate and Fast Thermal Model = Thermal Signature: 정확하고 빠른 온도 지표link Kung, Jae-Ha; 궁재하; et al, 한국과학기술원, 2012 |
Thermal signature: 자동 floorplanning을 위한 빠르고 정확한 온도 지표 신영수, 한국반도체학술대회, 한국반도체학회, 2011 |
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09 |
Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
Thermal stability of (HfO2)(x)(Al2O3)(1-x) on Si Yu, HY; Wu, N; Li, MF; Zhu, CX; Cho, Byung Jin; Kwong, DL; Tung, CH; et al, APPLIED PHYSICS LETTERS, v.81, no.19, pp.3618 - 3620, 2002-11 |
Thermal Stability of ALD-HfO(2)/GaAs Pretreated with Trimethylaluminium Byun, YC (Byun, Young-Chul); An, CH (An, Chee-Hong); Lee, Seok-Hee; Cho, MH (Cho, Mann-Ho); Kim, H (Kim, Hyoungsub), JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.159, no.1, pp.6 - 10, 2012 |
Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05 |
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion Jeong, Jaeyong; Kim, Seongkwang; Suh, Yoonje; Shim, Joonsup; Beak, Woo Jin; Choi, Sung Joon; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024-06 |
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