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Compact packaging of optical and electronic components for on-board optical interconnects Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02 |
하이브리드형 적외선 감지 소자를 위한 범프 연구 = Bump formation for hybrid infrared focal plane arraylink 이경호; Lee, Kyung-Ho; et al, 한국과학기술원, 2003 |
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