Showing results 1 to 4 of 4
An infrared sensing material using a large-grain polysilicon film Kim, TS; Lee, Hee Chul, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, v.44, pp.6052 - 6055, 2005-08 |
Grain Size Engineering using Amorphous-Ge/Si Stack to Enhance Channel Mobility for NAND Flash Memory Lee, Tae In; Kim, Min Ju; Shin, Eui Joong; Lee, Gyusoup; Jeong, Jaejoong; Lee, Yun Hee; Lee, Jung Hoon; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.69, no.10, pp.5940 - 5943, 2022-10 |
Insertion of Dielectric Interlayer: A New Approach to Enhance Energy Storage in HfxZr1-xO2 Capacitors Das, Dipjyoti; Gaddam, Venkateswarlu; Jeon, Sanghun, IEEE ELECTRON DEVICE LETTERS, v.42, no.3, pp.331 - 334, 2021-03 |
적외선 센서의 볼로미터 저항체로 사용된 다결정 실리콘 박막에 발생하는 TCR 및 1/f Noise의 최적화 방법에 관한 연구 = A research on how to optimize the level of the TCR and 1/f noise which occur in the polycrystalline silicon film used as a bolometer resistorlink 양진영; Yang, Jin-Young; et al, 한국과학기술원, 2006 |
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