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An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging Wygant, Ira O.; Jamal, Nafis S.; Lee, Hyunjoo J.; Nikoozadeh, Amin; Oralkan, Oemer; Karaman, Mustafa; Khuri-Yakub, Butrus T., IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.56, no.10, pp.2145 - 2156, 2009-10 |
Calcium-Modified Silk Patch as a Next-Generation Ultrasound Coupling Medium Lee, Sang-Mok; Lee, Taemin; Kim, Hyojung; Jo, Yehhyun; Kim, Myeong Gee; Kim, Subeen; Bae, Hyeon-Min; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.47, pp.55827 - 55839, 2021-12 |
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