Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Scalable model
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| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
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