Browse "School of Electrical Engineering(전기및전자공학부)" by Author Park, Shinyoung
Showing results 1 to 40 of 40
| A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System Sim, Boogyo; Jeong, Seungtaek; Kim, Youngwoo; Park, Shinyoung; Lee, Seongsoo; Hong, Seokwoo; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.935 - 946, 2021-06 |
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| Active Silicon Interposer Design for Interposer-Level Wireless Power Transfer Technology for High-Density 2.5-D and 3-D ICs Song, Jinwook; Park, Shinyoung; Kim, Sukjin; Kim, Jonghoon J.; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.8, pp.1148 - 1161, 2016-08 |
| Audio frequency ground integrity modeling and measurement for a TDMA smartphone system Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis Lho, Daehwan; Park, Junyong; Park, Hyunwook; Park, Shinyoung; Kim, SeongGuk; Kang, Hyungmin; Kim, Subin; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Subin; Kang, Hyungmin; Sim, Boogyo; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02 |
| Chip-level Wireless Power Transfer Scheme Design for Next Generation Wireless Interconnected Three-Dimensional Integrated Circuits Song, Jinwook; Jung, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Hong, Seokwoo; Kim, Joungho, IEEE Wireless Power Transfer Conference (WPTC), IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Controller Area Network With Flexible Data Rate (CAN FD) Eye Diagram Prediction Park, Junyong; Lee, Manho; Park, Shinyoung; Kim, Jonghoon; Kim, Joungho; Kim, Donghyun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.66, no.3, pp.949 - 959, 2024-06 |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; et al, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Park, Shinyoung; Park, Gap Yeol; Lho, Daewhan; Kim, Seoungguk; et al, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Design and analysis of an active simultaneously switching output noise reduction scheme Park, Shinyoung; Kim, Subin; Shin, Taein; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.222 - 225, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of Chip-level Wireless Power Transfer Using Magnetic-field Resonance Coupling and 0.18 um CMOS Technology Kim, Joungho; Song, Jinwook; Jeong, Seungtaek; Park, Shinyoung, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 |
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones Kim, Joungho; Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo, DesignCon 2018, DesignCon 2018, 2018-01-31 |
| Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip Shin, TaeIn; Son, Kyungjune; Kim, Seongguk; Cho, Kyungjun; Park, Shinyoung; Kim, Subin; Park, Gapyeol; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Modeling and analysis of ground integrity (GI) in power distribution network (PDN) of mobile systems and high bandwidth memory (HBM) = 모바일 시스템 및 고대역폭 메모리의 전력망에서 접지 무결성 모델링 및 분석link Park, Shinyoung; Kim, Joungho; et al, 한국과학기술원, 2021 |
| Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; et al, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling and verification of 3-dimensional resistive storage class memory with high speed circuits for core operation Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Shinyoung; Park, Gap Yeol; Kim, Seongguk; Shin, Taein; et al, 2019 IEEE Asia-Pacific Microwave Conference, APMC 2019, pp.694 - 696, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle Kim, Subin; Shin, Taein; Jeong, Seungtaek; Kang, Hyungmin; Son, Keeyoung; Park, Shinyoung; Kim, Hyunho; et al, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.287 - 292, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04 |
| Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27 |
| PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC Song, Jinwook; Kim, Joungho; Jeong, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Cho, Yeonje, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 |
| Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity Kim, Keunwoo; Park, Hyunwook; Kim, SeongGuk; Kim, Youngwoo; Son, Kyungjune; Lho, Daehwan; Son, Keeyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.66, no.1, pp.256 - 269, 2024-02 |
| Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling Park, Junyong; Park, Shinyoung; Kim, Youngwoo; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1867 - 1875, 2019-12 |
| Power integrity comparison of off-chip, on-interposer, on-chip voltage regulators in 2.5D/3D ICs Kim, Subin; Cho, Kyungjun; Park, Shinyoung; Park, Hyunwook; Kim, Seongguk; Jeong, Seungtaek; Son, Kyungjune; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Probe Card Design with Signal and Power Integrity for Wafer-level Application Processor Test in LPDDR Channel Kim, Joungho; Song, Jinwook; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 |
| Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01 |
| Signal integrity analysis of a super speed pair of a USB 3.0 connector with test Jig Kim, Joungho; Kim, Hyesoo; Park, Shinyoung; Kim, Jonghoon; Park, Jung-Min; Kim, UnHo; Jeon, YuckHwan, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017-12-15 |
| Signal Integrity Analysis of High-Speed Board-to-Board Floating Connectors for Automotive Systems Kim, Joungho; Park, Shinyoung; Kim, Hyesoo; Kim, Jonghoon; Kim, Unho; Park, Jungmin; Jeon, Yuckhwan, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, IEEE International Conference on Electrical Performance of Electronic Packaging Systems, 2017-10-17 |
| Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11 |
| Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network Shin, Taein; Park, Shinyoung; Kim, Seongguk; Kim, Subin; Son, Kyungjune; Park, Hyunwook; Lho, Daehwan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
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