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Browse "School of Electrical Engineering(전기및전자공학부)" by Author Lee, Manho

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Showing results 1 to 6 of 6

1	Ground Guard Structure to Reduce the Crosstalk Noise and Electromagnetic Interference (EMI) in a Vertical Probe Card for Wafer-level Testing Kim, Joung-Ho; Lee, Eunjung; Lee, Manho; Kim, Jonghoon J.; Kim, Mijoo; Kim, Jonghoon; Park, Jeoungkun; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-03
2	High-speed Probe Card Design to Reduce the Crosstalk Noise for Wafer-level Test Kim, Joung-Ho; Lee, Eunjung; Lee, Manho; Kim, Jonghoon J.; Kim, Mijoo; Kim, Jonghoon; Park,JK; et al, 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 2014-11-01
3	Investigation of LC-VCO Performance Degradation due to TSV-Coupled Noise in 3D IC Kim, Joungho; Lim, Jaemin; Cho, Jonghyun; Lee, Manho; Park, Kunwoo; Lee, Junho, 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013-09-03
4	Statistical eye diagram estimation method for 128b/130b-coded channel = 128b/130b 코딩된 채널에서의 확률적 아이 다이어그램 예측 방법 link Lee, Manho; 이만호; et al, 한국과학기술원, 2017
5	Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24
6	Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

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