Browse "School of Electrical Engineering(전기및전자공학부)" by Author Lee, Man Ho
Showing results 1 to 8 of 8
| A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10 |
| Audio frequency ground integrity modeling and measurement for a TDMA smartphone system Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| Design of On-Chip Linear Voltage Regulator ModuleAnd Measurement of Power Distribution NetworkNoise Fluctuation at High-Speed Output Buffer Lee, Man Ho; Kim, Hee Gon; Kim, Suk Jin; Kim, Joung Ho; Cho, Jong Hyun; Yoon, Chang Wook; Achkir, Brice; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25 |
| High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03 |
| Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12 |
| Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04 |
| Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC Lim, Jae Min; Lee, Man Ho; Jung, Daniel HY; Kim, Jong Hoon; Choi, Su Min; Lee, Hyun Suk; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
| Signal Integrity Design of High-speed Semiconductor Test Probe Card Kim, Jong Hoon; Song, Jin Wook; Lee, Eun Jung; Lee, Man Ho; Park, Jung Keun; Lee, Ji Sun; Kim, Hyun Min; et al, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
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