Showing results 1 to 11 of 11
A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling Kim, Keunwoo; Lee, Junghyun; Hong, Seokwoo; Kim, Hyunwoo; Sim, Boogyo; Son, Kyungjune; Shin, Taein; et al, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10 |
Adaptive Gramian-Angular-Field segmentation integration based Generative Adversarial Network (AGSI-GAN) for eye diagram estimation of high bandwidth memory interposer = 고대역폭 메모리 인터포저의 아이다이어그램 추정을 위한 적응형 그라미안-각도-필드 분할 통합 기반 적대적 생성 신경망link Lee, Junghyun; 이정현; et al, 한국과학기술원, 2024 |
Analysis of driver behavior based on machine learning algorithm using vehicle driving data in racing track = 레이싱 트랙에서의 차량 주행 데이터를 활용한 머신 러닝 알고리즘 기반 운전자 행동 분석 연구link Lee, Junghyun; Choi, Junkyun; et al, 한국과학기술원, 2021 |
Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
Driver Identification for Different Road Shapes Using Vehicle IoT Sensing Data Lee, Junghyun; Kim, Minkyung; Park, Sangdon; Choi, Jun Kyun; Hwang, Yoonjin, IEEE International Conference on Consumer Electronics (ICCE), IEEE, 2021-01 |
Fast and Accurate Computation of Wireless Power Transfer System Optimal Design Using Particle Swarm Optimization Method Sim, Boogyo; Shin, Taein; Park, Hyunwook; Son, Keeyoung; Kim, Keunwoo; Lho, Daehwan; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.65, no.6, pp.1674 - 1683, 2023-12 |
Fast and Efficient MMD-Based Fair PCA via Optimization over Stiefel Manifold Lee, Junghyun; Kim, Gwangsu; Olfat, Mahbod; Mark, Hasegawa-Johnson; Yoo, Chang-Dong, 36th AAAI Conference on Artificial Intelligence, AAAI-22, pp.7363 - 7371, Association for the Advancement of Artificial Intelligence (AAAI), 2022-02-24 |
Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling Kim, Keunwoo; Kim, Joungho; Lee, Junghyun; Hong, Seokwoo; Sim, BooGyo; Son, Kyungjune; Shin, TaeIn; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-12 |
Multilevel conductance switching for a monolayer of redox-active metal complexes through various metallic contacts Seo, Sohyeon; Lee, Junghyun; Choi, Sung-Yool; Lee, Hyoyoung, JOURNAL OF MATERIALS CHEMISTRY, v.22, no.5, pp.1868 - 1875, 2012 |
Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity Park, Joonsang; Choi, Seonguk; Son, Keeyoung; Lee, Junghyun; Shin, Taein; Kim, Keunwoo; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.14, no.4, pp.681 - 692, 2024-04 |
Solution-Processed Reduced Graphene Oxide Films as Electronic Contacts for Molecular Monolayer Junctions Seo, Sohyeon; Min, Misook; Lee, Junghyun; Lee, Takhee; Choi, Sung-Yool; Lee, Hyoyoung, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.51, no.1, pp.108 - 112, 2012-01 |
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