Showing results 7 to 8 of 8
Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC Lim, Jae Min; Lee, Man Ho; Jung, Daniel HY; Kim, Jong Hoon; Choi, Su Min; Lee, Hyun Suk; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
Signal Integrity Design of High-speed Semiconductor Test Probe Card Kim, Jong Hoon; Song, Jin Wook; Lee, Eun Jung; Lee, Man Ho; Park, Jung Keun; Lee, Ji Sun; Kim, Hyun Min; et al, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
Discover