Browse "School of Electrical Engineering(전기및전자공학부)" by Author Yu, J
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| Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array Kam, DG; Kim, Joungho; Yu, J; Choi, H; Bae, K; Lee, C, IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219, 2006-05 |
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