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Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
Modeling of through glass via(TGV) noise coupling and RF receiver performance degradation in glass interposers = 글래스 관통비아에서의 노이즈 커플링 모델링과 글래스 인터포저에서의 RF 수신단 성능저하 분석link Hwang, Insu; 황인수; et al, 한국과학기술원, 2016 |
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