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Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs Lee, J.; Kim, M.; Kim, Joungho; Rotaru, M.D.; Iyer, M.K., 2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004, pp.35 - 38, IEEE, 2004-08-09 |
Via and reference discontinuity impact on high-speed signal integrity Kim J.; Kim, Joungho; Rotaru, M.D.; Chong, K.C.; Iyer, M.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.583 - 587, IEEE, 2004-08-09 |
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