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High Speed and Low Noise Packaging Design Methodologies for 40 Gbps SerDes Channel with PBGA Type Package Kam, DG; Yu, J; Choi, H; Bae, K; Kim, J; Jeong, D.-K; Lee, C; et al, PIERS2006 conference, pp.128 - 128, PIERS, 2006-03-26 |
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array Kam, DG; Kim, Joungho; Yu, J; Choi, H; Bae, K; Lee, C, IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219, 2006-05 |
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