Showing results 5 to 9 of 9
Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 |
Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12 |
Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling Piersanti, S; Pellegrino, E; De Paulis, F; Orlandi, A; Kim, Joungho; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.406 - 411, Institute of Electrical and Electronics Engineers Inc., 2016-07 |
Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics Fan, Jun; Carvalho, Nuno Borges; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12 |
Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 |
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