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Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics Kim, Joungho; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 |
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