Showing results 1 to 3 of 3
Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling Kim, Joungho; Heegon Kim; Sukjin Kim; Changhyun Ch; Daniel H. Jung; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel Kim, Joungho; Heegon Kim; Jonghoon J; Sukjin Kim; Hyun-Cheol Bae; Kwang-Seong Cho, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 |
Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics Kim, Joungho; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 |
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