Showing results 6421 to 6440 of 14405
Geometric Criteria for the Quasi-Linearization of the Equations of Motion of Mechanical Systems Chang, Dong Eui; McLenaghan, Raymond G., IEEE TRANSACTIONS ON AUTOMATIC CONTROL, v.58, no.4, pp.1046 - 1050, 2013-04 |
Geometric derivation of the Delaunay variables and geometric phases Chang, Dong Eui; Marsden, JE, CELESTIAL MECHANICS & DYNAMICAL ASTRONOMY, v.86, no.2, pp.185 - 208, 2003-06 |
Geometric effects of nanocrystals in nonvolatile memory using block copolymer nanotemplate Lee, Jong-Won; Ryu, Seong-Wan; Shin, Dong Ok; Kim, Bong Hoon; Kim, Sang Ouk; Choi, Yang-Kyu, SOLID-STATE ELECTRONICS, v.53, no.6, pp.640 - 643, 2009-06 |
Geometric visual servoing Cowan, NJ; Chang, Dong Eui, IEEE TRANSACTIONS ON ROBOTICS, v.21, no.6, pp.1128 - 1138, 2005-12 |
Geometric-symmetry consideration on magneto-conductance oscillations in purely ballistic quantum rings Shin, Mincheol, SOLID STATE COMMUNICATIONS, v.128, no.11, pp.425 - 429, 2003-12 |
Geometrical and topological relationships between multiple functional maps in cat primary visual cortex Kim, Dae-Shik; Matsuda, Y; Ohki, K; Ajima, A; Tanaka, S, NEUROREPORT, v.10, no.12, pp.2515 - 2522, 1999-08 |
Geometrically induced multiple Coulomb blockade gaps Shin, Mincheol; Lee, S; Park, KW; Lee, EH, PHYSICAL REVIEW LETTERS, v.80, no.26, pp.5774 - 5777, 1998-06 |
Geometrically inspired MRF for moving object detection from mobile stereo camera Min, Ji-Hong; Kim, H.; Kim, Jung-Ho; Kweon, In-So, ELECTRONICS LETTERS, v.48, no.16, pp.993 - 994, 2012-08 |
Geometrically Structured Nanomaterials for Nanosensors, NEMS, and Nanosieves Seo, Min-Ho; Yoo, Jae-Young; Jo, Min-Seung; Yoon, Jun-Bo, ADVANCED MATERIALS, v.32, no.35, pp.1907082, 2020-09 |
Geometry engine architecture with early backface culling hardware Han, CY; Im, YH; Kim, Lee-Sup, COMPUTERS & GRAPHICS-UK, v.29, no.3, pp.415 - 425, 2005-06 |
Geometry Guided Three-Dimensional Propagation for Depth From Small Motion Shin, Seunghak; Im, Sunghoon; Shim, Inwook; Jeon, Hae-Gon; Kweon, In So, IEEE SIGNAL PROCESSING LETTERS, v.24, no.12, pp.1857 - 1861, 2017-12 |
Geometry Information-based Practical Device Identification for Local Device-to-device Communication Park, Eunhye; Lee, Kwang-Eog; Kang, Joon-Hyuk, 한국정보전자통신기술학회 논문지, v.7, no.4, pp.159 - 167, 2014-12 |
Germanium electron-hole bilayer tunnel field-effect transistors with a symmetrically arranged double gate Jeong, Woo-Jin; Kim, Tae Kyun; Moon, Jung Min; Park, Min Gyu; Yoon, Young Gwang; Hwang, Byeong Woon; Choi, Woo Young; et al, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.30, no.3, 2015-03 |
Gesture-based Interface using Multiple Cameras for Home Appliance Control Do, Jun-Hyeong; Jung, Sung Hoon; Yang, Seung-Eun; Jang, Hyoyoung; Jung, Jin-Woo; Bien, Zeung nam, INTERNATIONAL JOURNAL OF ASSISTIVE ROBOTICS AND MECHATRONICS, v.8, no.2, pp.33 - 43, 2007-06 |
Giant Frictional Drag in Double Bilayer Graphene Heterostructures Lee, Kayoung; Xue, Jiamin; Dillen, David C.; Watanabe, Kenji; Taniguchi, Takashi; Tutuc, Emanuel, PHYSICAL REVIEW LETTERS, v.117, no.4, 2016-07 |
Giga Bit급 저전력 Synchronous DRAM 구조에 대한 연구 유회준; 이장우, 대한전자공학회 논문지, v.34C, no.11, pp.1 - 11, 1997-11 |
Giga-Bit급 DRAM을 위한 고유전 (Ba,Sr)TiO3 박막 커패시터의 유전완화 특성에 대한 회로 모델 Lee, Hui-Cheol; Jang, Byeong-Tak; Cha, Seon-Yong, 전자공학회논문지, v.37, no.4, pp.253 - 262, 2000-04 |
Glass barrier ribs for a transparent AC plasma display Lee, Sung-Min; Oh, Seung-Hwa; Kim, Seung-Hun; Choi, Kyung-Cheol, JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, v.18, pp.717 - 720, 2010-10 |
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
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