Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article
Showing results 12241 to 12260 of 14428
| Three-stage model for robust real-time face tracking Do, Jun-Hyeong; Bien, Zeung nam, INTERNATIONAL JOURNAL OF IMAGING SYSTEMS AND TECHNOLOGY, v.17, no.6, pp.321 - 327, 2007 |
| Three-STEP HEURISTIC ALGORITHM FOR OPTIMAL PLA COLUMN FOLDING YANG, YY; Kyung, Chong-Min, ELECTRONICS LETTERS, v.24, no.17, pp.1088 - 1090, 1988-08 |
| Three-STEP PIN ASSIGNMENT ALGORITHM FOR BUILDING BLOCK LAYOUT CHOI, SG; Kyung, Chong-Min, ELECTRONICS LETTERS, v.28, no.20, pp.1882 - 1884, 1992-09 |
| Three-Switch Active-Clamp Forward Converter With Low Switch Voltage Stress and Wide ZVS Range for High-Input-Voltage Applications Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung Joong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.889 - 898, 2010-04 |
| Three-terminal vertical ferroelectric synaptic barristor enabled by HZO/ graphene heterostructure with rebound depolarization Jang, Seonghoon; Kim, Yongjun; Jeon, Jihoon; Ham, Seonggil; Choi, Sanghyeon; Yang, Jehyeon; Kim, Seong Keun; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.965, 2023-11 |
| Three-transistor one-time programmable (OTP) ROM cell array using standard CMOS gate oxide antifuse Kim, J; Lee, Kwyro, IEEE ELECTRON DEVICE LETTERS, v.24, pp.589 - 591, 2003-09 |
| THRESHOLD BOOLEAN FILTERS LEE, KD; Lee, Yong-Hoon, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.42, no.8, pp.2022 - 2036, 1994-08 |
| THRESHOLD SELECTION ALGORITHM FOR EXTRACTING A UNIFORM COLOR REGION IN AN IMAGE CHANG, BH; Kim, Seong-Dae; Kim, Jae Kyoon, ELECTRONICS LETTERS, v.23, no.25, pp.1362 - 1363, 1987-12 |
| Threshold Voltage Tuning Technique in Gate-All-Around MOSFETs by Utilizing Gate Electrode With Potential Distribution Park, Jun-Young; Bae, Hagyoul; Moon, Dong-Il; Jeon, Chang-Hoon; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.37, no.11, pp.1391 - 1394, 2016-11 |
| Threshold-based camera motion characterization of MPEG video Kim, JG; Chang, HS; Kim, J; Kim, Hyung-Myung, ETRI JOURNAL, v.26, pp.269 - 272, 2004-06 |
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations Kim, Tae-Joon; Lim, Jong-Tae, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03 |
| THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX KIM, SR; Un, Chong-Kwan, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11 |
| THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS LIM, DM; Lee, Hwang Soo, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09 |
| Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism Lee, IG; Yoo, Hyung Joun; Park, Sin Chong, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01 |
| Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management Tsiaflakis, Paschalis; Yi, Yung; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09 |
| Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System Hong, Jun-Pyo; Choi, Wan, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08 |
| Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure W.Y.Jung; C.K.Un, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09 |
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