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3D RF front end module packaging using anodized aluminum substrate = 양극 산화 알루미늄 기판을 이용한 3 차원 프론트 엔드 모듈 패키징link Yu, Je-In; 유제인; Hong, Song-Cheoll; 홍성철; et al, 한국과학기술원, 2012 |
Low insertion loss K-band BPF using parallel-coupled air-suspended microstrip lines on anodised aluminium substrate Yu, Je-In; Kwon, Young-Se, ELECTRONICS LETTERS, v.48, no.8, pp.437 - 438, 2012-04 |
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