Showing results 1 to 12 of 12
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; et al, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27 |
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12 |
Analysis of the effect of digital power ground noise on active balun in UHF RTID SiP Park, J.; Ryu, C.; Yoon, C.; Koo, K.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.586 - 590, IEEE, 2007-12-12 |
Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06 |
Design of UWB transceiver SiP for short range communication Yoon, C.; Park, H.; Kim, Joungho; Lee, J.; Park, Y., IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
Joint frame/frequency synchronization and channel estimation for single-carrier FDE 60 GHz WPAN system Yoon, C.; Lee, H.; Lee, W.Y.; Kang, Joonhyuk, 2010 7th IEEE Consumer Communications and Networking Conference, CCNC 2010, IEEE, 2010-01-09 |
Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 |
Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
Packet transmission utilizing single-carrier FDE technique in a modified cdma2000 based cellular system Yoon, C.; Lee, W.Y.; Chung, H.K.; Kang, Joonhyuk, 2010 International Conference on Information and Communication Technology Convergence, ICTC 2010, pp.260 - 263, ICTC 2010, 2010-11-17 |
Performance enhancement of F-PDCH using oversampling diversity MMSE receive equalizer Yoon, C.; Kang, Joonhyuk, 2005 IEEE 61st Vehicular Technology Conference -VTC 2005 - Spring Stockholm: Paving the Path for a Wireless Future, v.61, pp.753 - 757, 2005-05-30 |
Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP) Kim, M.; Yoon, C.; Koo, K.; Hwang, C.; Sung, H.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.28 - 31, IEEE, 2010-07-25 |
Discover