Measurement of Adhesion and Mechanical Properties of Thin Films
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | - |
| dc.date.accessioned | 2015-07-22T02:52:50Z | - |
| dc.date.available | 2015-07-22T02:52:50Z | - |
| dc.date.created | 2015-07-03 | - |
| dc.date.issued | 2015-04-02 | - |
| dc.identifier.citation | The Korean Microelectronics and Packaging Society 2015 Spring Meeting, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/199857 | - |
| dc.language | ENG | - |
| dc.publisher | 한국 마이크로 전자 및 패키징 학회 | - |
| dc.title | Measurement of Adhesion and Mechanical Properties of Thin Films | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The Korean Microelectronics and Packaging Society 2015 Spring Meeting | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
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