Mechanical Reliability of Advanced Thin Films
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2015-07-22T02:52:47Z | - |
| dc.date.available | 2015-07-22T02:52:47Z | - |
| dc.date.created | 2015-07-03 | - |
| dc.date.issued | 2015-04-16 | - |
| dc.identifier.citation | International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/199855 | - |
| dc.language | English | - |
| dc.publisher | International Conference on Electronic Packaging | - |
| dc.title | Mechanical Reliability of Advanced Thin Films | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015) | - |
| dc.identifier.conferencecountry | JA | - |
| dc.identifier.conferencelocation | Kyoto Terrsa | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
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- ME-Conference Papers(학술회의논문)
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