Reduced Interface Diffusion of Cu Interconnects by Graphene-Based Capping Layer
- Publisher
- 한국그래핀연구회
- Issue Date
- 2015-03-26
- Language
- English
- Citation
The 2nd Korean Graphene Symposium
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.