Energy release rate in the presence of residual and thermal stresses

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dc.contributor.authorPark, Jeong Soonko
dc.contributor.authorChoi, Young Hwanko
dc.contributor.authorKim, Jung Doko
dc.contributor.authorIm, Se-Youngko
dc.date.accessioned2015-04-29T01:27:03Z-
dc.date.available2015-04-29T01:27:03Z-
dc.date.created2015-04-27-
dc.date.created2015-04-27-
dc.date.issued2015-05-
dc.identifier.citationINTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.59, pp.73 - 78-
dc.identifier.issn0020-7683-
dc.identifier.urihttp://hdl.handle.net/10203/198307-
dc.description.abstractThis paper presents a thermodynamic formulation of the J-integral in the presence of residual stress and thermal stress. First, the Helmholtz free energy and the internal energy are derived considering residual and thermal stresses. With the use of these thermodynamic potentials, the energy release rate, J-integral, is derived for thermo-elastic body with residual stresses in isothermal condition. It is verified that the resulting J-integral in the absence of residual stress is identical with the definition of J reported earlier. Furthermore, it is shown that the J-integral in the presence of residual and thermal stresses does not depend on the integration path and domain.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectCRACK-
dc.subjectFRACTURE-
dc.subjectINTEGRALS-
dc.titleEnergy release rate in the presence of residual and thermal stresses-
dc.typeArticle-
dc.identifier.wosid000351965900007-
dc.identifier.scopusid2-s2.0-84924957330-
dc.type.rimsART-
dc.citation.volume59-
dc.citation.beginningpage73-
dc.citation.endingpage78-
dc.citation.publicationnameINTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES-
dc.identifier.doi10.1016/j.ijsolstr.2015.01.013-
dc.contributor.localauthorIm, Se-Young-
dc.contributor.nonIdAuthorPark, Jeong Soon-
dc.contributor.nonIdAuthorChoi, Young Hwan-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorJ-integral-
dc.subject.keywordAuthorPath independence-
dc.subject.keywordAuthorResidual stress-
dc.subject.keywordAuthorThermal stress-
dc.subject.keywordPlusCRACK-
dc.subject.keywordPlusFRACTURE-
dc.subject.keywordPlusINTEGRALS-
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