DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Bae, Byeong-Soo | - |
dc.contributor.advisor | 배병수 | - |
dc.contributor.author | Kim, Hwea-Yoon | - |
dc.contributor.author | 김회윤 | - |
dc.date.accessioned | 2015-04-23T07:11:17Z | - |
dc.date.available | 2015-04-23T07:11:17Z | - |
dc.date.issued | 2014 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=569141&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/197381 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 신소재공학과, 2014.2, [ v, 81 p. ] | - |
dc.description.abstract | In recent years, there has been growing interest from numerous consumer and electronic manufacturers to apply flexible displays on the electronic device. A flexible devices have the large potential to revolutionize the way the world interacts with electronics. [1, 2] Nick Colaneri, director of Arizona State University’s Flexible Dis-play Center said “To make a flexible display, the first thing you have to do is get rid of glass”. However, to find an ideal and appropriate substrate for the flexible display is still remain. In fact, plastic substrate is a major con-cern in flexible display field from the old times. [1-3] Polyethersulfone (PES) substrate is the major concern of PM LCD in the late 1990s and polyimide (PI) substrate is become the focus of AMOLED substrate in the present day. [4] Recently, some of plastic substrates such as polyethylene terephthalate (PET, Melenix® from Dupont Teijin Films), polyethylene naphthalate (PEN, Teonex® Q65 from DuPont Teijin Films), poly carbonate (PC, Lexan® from GE), polyethersulfone (PES, Sumilite® from Sumitomo Bakellite) and polyimide (PI, Kapton® from DuPont) and also glass-fiber reinforced composite substrate has been on the spotlight to apply flexible substrate because they are thin, lightweight, durable, conformable and flexible. [2-4] However, there are several major chal-lenges about flexible substrates. General plastic substrate has low glass-transition temperature (Tg) but Tg of glass substrate is ~660°C for the conventional flat panel display. The maximum process temperature is decided near the Tg of substrate, therefore it should be achieved lower TFT manufacturing process temperature or en-hance the thermal stability of the plastic substrate to manufacture TFT on the plastic substrate. Also, dimen-sional stability is critical factor to manufacture the accurate TFT arrays on the plastic substrate. The fabrication process of TFT array include repeated steps of film deposition, photolithography, etching and c... | eng |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | Sol-gel hybrid material | - |
dc.subject | 열 안정성 | - |
dc.subject | 열팽창계수 | - |
dc.subject | 플렉시블 기판 | - |
dc.subject | 유리섬유 강화 | - |
dc.subject | 솔-젤 하이브리드 재료 | - |
dc.subject | Glass-fabric reinforced composite | - |
dc.subject | Flexible substrate | - |
dc.subject | Coefficient of thermal expansion | - |
dc.subject | Thermal stability | - |
dc.title | Thermally stable transparent glass-fabric reinforced hybrimer film using vinyl oligosiloxane resin | - |
dc.title.alternative | 비닐 올리고실록산 수지를 이용한 내열 투명 유리섬유 강화 하이브리머 필름 | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 569141/325007 | - |
dc.description.department | 한국과학기술원 : 신소재공학과, | - |
dc.identifier.uid | 020123204 | - |
dc.contributor.localauthor | Bae, Byeong-Soo | - |
dc.contributor.localauthor | 배병수 | - |
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